What We Do

At ESR we have used thermal imaging to identify and correct operating problems across a range of different electronic systems

• Identify hot spots within a product
• Identify the cause of the hot spot
• Make modifications to eliminate the problem

Benefits of this approach

Once a PCB has been created and is in use, there can be various problems that arise. It could simply be reliability, where the components are failing prematurely, or behaving unexpectedly. Alternatively the application itself could be safety critical, and excess heat generation could have further consequences.

In all of these cases, using thermal imaging will allow us to identify potential problems quicker than other methods (and before failure). Once the problem has been identified, a solution can be developed then checked to confirm the desired results.